(footprint "ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger"
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	(layer "F.Cu")
	(descr "ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101")
	(tags "CSP 19 0.35 ST-Die-493 ST-Package-B0MQ")
	(solder_mask_margin 0.0375)
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		(size 0.2 0.2)
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	(pad "K1" smd circle
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	(pad "K3" smd circle
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	(pad "L2" smd circle
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	(pad "L4" smd circle
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		(property pad_prop_bga)
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	(embedded_fonts no)
	(model "${KICAD10_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger.step"
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			(xyz 0 0 0)
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		(scale
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		(rotate
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)
